MC100EP52DTR2G资料
MC10EP52, MC100EP523.3V / 5VECL DifferentialData and Clock D Flip−Flop
Description
The MC10EP/100EP52 is a differential data, differential clock Dflip−flop. The device is pin and functionally equivalent to the EL52device.
Data enters the master portion of the flip−flop when the clock isLOW and is transferred to the slave, and thus the outputs, upon apositive transition of the clock. The differential clock inputs of theEP52 allow the device to also be used as a negative edge triggereddevice.
The EP52 employs input clamping circuitry so that under open inputconditions (pulled down to VEE) the outputs of the device will remainstable.
The 100 Series contains temperature compensation.
Features
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MARKINGDIAGRAMS*81SOIC−8D SUFFIXCASE 7511HEP52ALYWG8KEP52ALYWG815T MGGDFN8MN SUFFIXCASE 506AAHK5T3O= MC10= MC100= MC10= MC100141A= Assembly LocationL= Wafer LotY= YearW= Work WeekM= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)*For additional marking information, refer to Application Note AND8002/D.ORDERING INFORMATION
See detailed ordering and shipping information in the packagedimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 6
1
Publication Order Number:
MC10EP52/D
3OMGG4••••••••
330 ps Typical Propagation Delay
Maximum Frequency u 4 GHz Typical
PECL Mode: VCC = 3.0 V to 5.5 V with VEE = 0 VNECL Mode: VCC = 0 V with VEE = −3.0 V to −5.5 VOpen Input Default StateSafety Clamp on Inputs
Q Output Will Default LOW with Inputs Open or at VEEPb−Free Packages are Available
81TSSOP−8DT SUFFIXCASE 948R8HP52ALYWGG8KP52ALYWGG11元器件交易网www.cecb2b.com
MC10EP52, MC100EP52
Table 1. PIN DESCRIPTION
PINCLK*, CLK*D2D7Flip-FlopCLK
36QQ
D*, D*Q, QVCCVEEEPFUNCTIONECL Clock InputsECL Data InputECL Data OutputsPositive SupplyNegative SupplyExposed pad must be connected to asufficient thermal conduit. Electricallyconnect to the most negative supply orleave floating open.D18VCC
CLK45VEE
*Pins will default LOW when left open.
Table 2. TRUTH TABLE
Figure 1. 8−Lead Pinout (Top View) and Logic Diagram
DLH
CLKZZ
QLH
Z = LOW to HIGH Transition
Table 3. ATTRIBUTES
Characteristics
Internal Input Pulldown ResistorInternal Input Pullup ResistorESD Protection
Human Body Model
Machine Model
Charged Device Model
Pb PkgLevel 1Level 1Level 1
Value75 kWN/A> 4 kV> 200 V> 2 kV
Pb−Free PkgLevel 1Level 3Level 1
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC−8TSSOP−8
DFN8
Flammability RatingTransistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test1.For additional information, see Application Note AND8003/D.
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
155 Devices
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MC10EP52, MC100EP52
Table 4. MAXIMUM RATINGS
SymbolVCCVEEVIIoutIBBTATstgqJAqJCqJAqJCqJATsol
Parameter
PECL Mode Power SupplyNECL Mode Power SupplyPECL Mode Input VoltageNECL Mode Input VoltageOutput CurrentVBB Sink/Source
Operating Temperature RangeStorage Temperature Range
Thermal Resistance (Junction−to−Ambient)Thermal Resistance (Junction−to−Case)Thermal Resistance (Junction−to−Ambient)Thermal Resistance (Junction−to−Case)Thermal Resistance (Junction−to−Ambient)Wave Solder
PbPb−Free
0 lfpm500 lfpmStandard Board0 lfpm500 lfpmStandard Board0 lfpm500 lfpm
<2 to 3 sec @ 248°C<2 to 3 sec @ 260°C
SOIC−8SOIC−8SOIC−8TSSOP−8TSSOP−8TSSOP−8DFN8DFN8
Condition 1VEE = 0 VVCC = 0 VVEE = 0 VVCC = 0 VContinuousSurge
VI v VCCVI w VEE
Condition 2
Rating6−66−650100± 0.5−40 to +85−65 to +150
19013041 to 4418514041 to 4412984265265
UnitVVVVmAmAmA°C°C°C/W°C/W°C/W°C/W°C/W°C/W°C/W°C/W°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.
Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply CurrentOutput HIGH Voltage (Note 3)Output LOW Voltage (Note 3)Input HIGH Voltage (Single−Ended)Input LOW Voltage (Single−Ended)Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 4)
Input HIGH CurrentInput LOW Current
0.5Min2021651365209013652.0
Typ3422901490
Max4424151615241516903.3
Min2022301430215514302.0
25°CTyp3523551555
Max4524801680248017553.3
Min2022901490221514902.0
85°CTyp3724151615
Max4725401740254018153.3
UnitmAmVmVmVmVV
IIHIIL
150
0.5
150
0.5
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
2.Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.3.All loading with 50 W to VCC − 2.0 V.
4.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
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MC10EP52, MC100EP52
Table 6. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 5)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply CurrentOutput HIGH Voltage (Note 6)Output LOW Voltage (Note 6)Input HIGH Voltage (Single−Ended)Input LOW Voltage (Single−Ended)Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 7)
Input HIGH CurrentInput LOW Current
0.5Min2038653065379030652.0
Typ3439903190
Max4441153315411533905.0
Min2039303130385531302.0
25°CTyp3540553255
Max4541803380418034555.0
Min2039903190391531902.0
85°CTyp3741153315
Max4742403440424035155.0
UnitmAmVmVmVmVV
IIHIIL
150
0.5
150
0.5
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
5.Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.6.All loading with 50 W to VCC − 2.0 V.
7.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
Table 7. 10EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 8)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply CurrentOutput HIGH Voltage (Note 9)Output LOW Voltage (Note 9)Input HIGH Voltage (Single−Ended)Input LOW Voltage (Single−Ended)Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 10)
Input HIGH CurrentInput LOW Current
0.5Min20−1135−1935−1210−1935VEE+2.0
Typ34−1010−1810
Max44−885−1685−885−16100.0
Min20−1070−1870−1145−1870VEE+2.0
25°CTyp35−945−1745
Max45−820−1620−820−15450.0
Min20−1010−1810−1085−1810VEE+2.0
85°CTyp37−885−1685
Max47−760−1560−760−14850.0
UnitmAmVmVmVmVV
IIHIIL
150
0.5
150
0.5
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
8.Input and output parameters vary 1:1 with VCC.9.All loading with 50 W to VCC − 2.0 V.
10.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
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MC10EP52, MC100EP52
Table 8. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 11)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 12)Output LOW Voltage (Note 12)Input HIGH Voltage (Single−Ended)Input LOW Voltage (Single−Ended)Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 13)
Input HIGH CurrentInput LOW Current
0.5Min2021551355207513552.0
Typ3422801480
Max4424051605242016753.3
Min2021551355207513552.0
25°CTyp3522801480
Max4524051605242016753.3
Min2021551355207513552.0
85°CTyp3722801480
Max4724051605242016753.3
UnitmAmVmVmVmVV
IIHIIL
150
0.5
150
0.5
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
11.Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.12.All loading with 50 W to VCC − 2.0 V.
13.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
Table 9. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 14)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 15)Output LOW Voltage (Note 15)Input HIGH Voltage (Single−Ended)Input LOW Voltage (Single−Ended)Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 16)
Input HIGH CurrentInput LOW Current
0.5Min2038553055377530552.0
Typ3439803180
Max4441053305412033755.0
Min2038553055377530552.0
25°CTyp3539803180
Max4541053305412033755.0
Min2038553055377530552.0
85°CTyp3739803180
Max4741053305412033755.0
UnitmAmVmVmVmVV
IIHIIL
150
0.5
150
0.5
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
14.Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.15.All loading with 50 W to VCC − 2.0 V.
16.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
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MC10EP52, MC100EP52
Table 10. 100EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 17)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 18)Output LOW Voltage (Note 18)Input HIGH Voltage (Single−Ended)Input LOW Voltage (Single−Ended)Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 19)
Input HIGH CurrentInput LOW Current
0.5Min20−1145−1945−1225−1945VEE+2.0
Typ34−1020−1820
Max44−895−1695−880−16250.0
Min20−1145−1945−1225−1945VEE+2.0
25°CTyp35−1020−1820
Max45−895−1695−880−16250.0
Min20−1145−1945−1225−1945VEE+2.0
85°CTyp37−1020−1820
Max47−895−1695−880−16250.0
UnitmAmVmVmVmVV
IIHIIL
150
0.5
150
0.5
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
17.Input and output parameters vary 1:1 with VCC.18.All loading with 50 W to VCC − 2.0 V.
19.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
Table 11. AC CHARACTERISTICS VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 20)
−40°C
SymbolVOUTpptPLH,tPHLtStHtJITTERVPPtrtf
Characteristic
Output Voltage Amplitude @ 3.0 GHz(Figure 2)
Propagation Delay to Output Differential
CLK, CLK−>Q, QSetup TimeHold Time
CLOCK Random Jitter (RMS)(Figure 2)
Input Voltage Swing
(Differential Configuration)Output Rise/Fall Times(20% − 80%)
Q, Q150250500
0.2800
11200
150
300
350
280500
0.2800
11200
150
330
380
310500
0.2800
11200
360
410
pspsmVps
70
110
170
80
120
180
90
130
200
Min630
Typ750
Max
Min610
25°CTyp730
Max
Min520
85°CTyp640
Max
UnitGHzps
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
20.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
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MC10EP52, MC100EP52
0.90.8VOUTpp (mV)0.70.60.50.40.30.20.10.00.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
5 V3.3 VFREQUENCY (MHz)
Figure 2. Fmax Typical
QDriverDeviceQZo = 50 WDReceiverDeviceZo = 50 W50 W50 WDVTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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MC10EP52, MC100EP52
ORDERING INFORMATION
Device
MC10EP52DMC10EP52DGMC10EP52DR2MC10EP52DR2GMC10EP52DTMC10EP52DTGMC10EP52DTR2MC10EP52DTR2GMC10EP52MNR4MC10EP52MNR4GMC100EP52DMC100EP52DGMC100EP52DR2MC100EP52DR2GMC100EP52DTMC100EP52DTGMC100EP52DTR2MC100EP52DTR2GMC100EP52MNR4MC100EP52MNR4G
PackageSO−8SO−8(Pb−Free)SO−8SO−8(Pb−Free)TSSOP−8TSSOP−8(Pb−Free)TSSOP−8TSSOP−8(Pb−Free)DFN8DFN8(Pb−Free)SO−8SO−8(Pb−Free)SO−8SO−8(Pb−Free)TSSOP−8TSSOP−8(Pb−Free)TSSOP−8TSSOP−8(Pb−Free)DFN8DFN8(Pb−Free)
Shipping†98 Units / Rail98 Units / Rail2500 Tape & Reel2500 Tape & Reel100 Units / Rail100 Units / Rail2500 Tape & Reel2500 Tape & Reel1000 / Tape & Reel1000 / Tape & Reel98 Units / Rail98 Units / Rail2500 Tape & Reel2500 Tape & Reel100 Units / Rail100 Units / Rail2500 Tape & Reel2500 Tape & Reel1000 / Tape & Reel1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.
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MC10EP52, MC100EP52
Resource Reference of Application Notes
AN1405/DAN1406/DAN1503/DAN1504/DAN1568/DAN1672/DAND8001/DAND8002/DAND8020/DAND8066/DAND8090/D
−ECL Clock Distribution Techniques−Designing with PECL (ECL at +5.0 V)−ECLinPSt I/O SPiCE Modeling Kit−Metastability and the ECLinPS Family−Interfacing Between LVDS and ECL−The ECL Translator Guide−Odd Number Counters Design−Marking and Date Codes−Termination of ECL Logic Devices−Interfacing with ECLinPS
−AC Characteristics of ECL Devices
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MC10EP52, MC100EP52
PACKAGE DIMENSIONS
SOIC−8 NBCASE 751−07ISSUE AH
−X−A85B1S40.25 (0.010)MYM−Y−GKNOTES:
1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.
2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A AND B DO NOT INCLUDEMOLD PROTRUSION.
4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.
5.DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.
6.751−01 THRU 751−06 ARE OBSOLETE. NEWSTANDARD IS 751−07.
MILLIMETERSMINMAX4.805.003.804.001.351.750.330.511.27 BSC0.100.250.190.250.401.270 _8 _0.250.505.806.20INCHES
MINMAX0.1890.1970.1500.1570.0530.0690.0130.0200.050 BSC0.0040.0100.0070.0100.0160.0500 _8 _0.0100.0200.2280.244C−Z−HD0.25 (0.010)
MSEATINGPLANENX 45_0.10 (0.004)MJZY
SX
SDIMABCDGHJKMNSSOLDERING FOOTPRINT*
1.520.0607.00.2754.00.1550.60.0241.2700.050SCALE 6:1
mmǓǒinches*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
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MC10EP52, MC100EP52
PACKAGE DIMENSIONS
TSSOP−8DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x REFK0.15 (0.006)TUS2X0.10 (0.004)L/2815MTUSVSLPIN 1IDENT4B−U−0.25 (0.010)M0.15 (0.006)TUSA−V−FDETAIL ENOTES:
1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: MILLIMETER.
3.DIMENSION A DOES NOT INCLUDE MOLD FLASH.PROTRUSIONS OR GATE BURRS. MOLD FLASHOR GATE BURRS SHALL NOT EXCEED 0.15(0.006) PER SIDE.
4.DIMENSION B DOES NOT INCLUDE INTERLEADFLASH OR PROTRUSION. INTERLEAD FLASH ORPROTRUSION SHALL NOT EXCEED 0.25 (0.010)PER SIDE.
5.TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.
6.DIMENSION A AND B ARE TO BE DETERMINEDAT DATUM PLANE −W−.
MILLIMETERSMINMAX2.903.102.903.100.801.100.050.150.400.700.65 BSC0.250.404.90 BSC0 6 __INCHESMINMAX0.1140.1220.1140.1220.0310.0430.0020.0060.0160.0280.026 BSC0.0100.0160.193 BSC0 6 __C0.10 (0.004)−T−SEATINGPLANEDGDETAIL E−W−DIMABCDFGKLMhttp://onsemi.com
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MC10EP52, MC100EP52
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
DABPIN ONEREFERENCENOTES:1.DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994 .2.CONTROLLING DIMENSION: MILLIMETERS.3.DIMENSION b APPLIES TO PLATEDTERMINAL AND IS MEASURED BETWEEN0.25 AND 0.30 MM FROM TERMINAL.4.COPLANARITY APPLIES TO THE EXPOSEDPAD AS WELL AS THE TERMINALS.DIMAA1A3bDD2EE2eKLMILLIMETERSMINMAX0.801.000.000.050.20 REF0.200.302.00 BSC1.101.302.00 BSC0.700.900.50 BSC0.20−−−0.250.35E2 X0.10C2 X0.10CTOP VIEW0.10C8 X
A(A3)Ce18 X40.08CSEATINGPLANEA1SIDE VIEWD2e/2LE2K858 Xb0.10CAB0.05CNOTE 3ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
BOTTOM VIEW
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone: 303−675−2175 or 800−344−3860 Toll Free USA/CanadaFax: 303−675−2176 or 800−344−3867 Toll Free USA/CanadaEmail: orderlit@onsemi.comN. American Technical Support: 800−282−9855 Toll FreeUSA/CanadaEurope, Middle East and Africa Technical Support:Phone: 421 33 790 2910Japan Customer Focus CenterPhone: 81−3−5773−3850ON Semiconductor Website: www.onsemi.comOrder Literature: http://www.onsemi.com/orderlitFor additional information, please contact your localSales Representativehttp://onsemi.com12MC10EP52/D
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